Stacked type capacitor without carbon paste layer, manufacturing method thereof and silver paste layer

ABSTRACT

A stacked type capacitor without carbon paste layer includes a metal foil, an oxide layer, a polymer composite layer and a silver paste layer. The oxide layer is formed on the outer surface of the metal foil to entirely enclose the metal foil. The polymer composite layer is formed on the oxide layer to partially enclose the oxide layer. The silver paste layer is directly formed on the polymer composite layer to directly enclose the polymer composite layer. The oxide layer and the polymer composite layer are connected with each other to form a first connection interface between the oxide layer and the polymer composite layer. The polymer composite layer and the silver paste layer are connected with each other without a carbon paste layer to form a second connection interface between the polymer composite layer and the silver paste layer.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of priority to Taiwan PatentApplication No. 107133403, filed on Sep. 21, 2018. The entire content ofthe above identified application is incorporated herein by reference.

Some references, which may include patents, patent applications andvarious publications, may be cited and discussed in the description ofthis disclosure. The citation and/or discussion of such references isprovided merely to clarify the description of the present disclosure andis not an admission that any such reference is “prior art” to thepresent disclosure described herein. All references cited and discussedin this specification are incorporated herein by reference in theirentireties and to the same extent as if each reference was individuallyincorporated by reference.

FIELD OF THE PRESENT DISCLOSURE

The present disclosure relates to a stacked type capacitor, amanufacturing method thereof and a silver paste layer, and moreparticularly to a stacked type capacitor without a carbon paste layer, amanufacturing method thereof, and a silver paste layer.

BACKGROUND OF THE PRESENT DISCLOSURE

Capacitors have been widely used in consumer appliances, computermotherboards and peripherals thereof, power supplies, communicationproducts, and basic components for automobiles. The main functions ofcapacitors, including filtering, bypassing, rectifying, coupling,decoupling and switching, make them indispensable components inelectronic products. Capacitors are available in different typesdepending on their materials and applications, which include aluminumelectrolytic capacitors, tantalum electrolytic capacitors, multilayerceramic capacitors and film capacitors. A conventional solidelectrolytic capacitor enjoys the advantages of having a small size,large capacitance and superior frequency characteristics, and can beused for decoupling a power supply circuit of a central processing unit.In general, a plurality of capacitor units can be stacked to form aconventional high-capacity solid electrolytic capacitor which includes aplurality of capacitor units and lead frames. Each of the capacitorunits includes an anode portion, a cathode portion and an insulatingportion, and the insulating portion electrically insulates the anodeportion from the cathode portion. However, each capacitor unit stillneeds to use a carbon paste layer, which leaves room for improvement.

SUMMARY OF THE PRESENT DISCLOSURE

In response to the above-referenced technical inadequacies, the presentdisclosure provides a stacked type capacitor without a carbon pastelayer, a manufacturing method thereof, and a silver paste layer.

In one aspect, the present disclosure is directed to a stacked typecapacitor without a carbon paste layer, which includes a metal foil, anoxide layer, a polymer composite layer, and a silver paste layer. Theoxide layer is formed on an outer surface of the metal foil to entirelyenclose the metal foil. The polymer composite layer is formed on theoxide layer to partially enclose the oxide layer. The silver paste layeris formed directly on the polymer composite layer to directly enclosethe polymer composite layer. The oxide layer and the polymer compositelayer are connected with each other to form a first connection interfacebetween the oxide layer and the polymer composite layer. The polymercomposite layer and the silver paste layer are connected with each otherdirectly without the carbon paste layer to form a second connectioninterface between the polymer composite layer and the silver pastelayer.

In another aspect, the present disclosure is directed to a manufacturingmethod for a stacked type capacitor without a carbon paste layer. Themanufacturing method includes: providing a metal foil; forming an oxidelayer on an outer surface of the metal foil to entirely enclose themetal foil; forming a polymer composite layer on the oxide layer topartially enclose the oxide layer; and forming a silver paste layerdirectly on the polymer composite layer to directly enclose the polymercomposite layer. The oxide layer and the polymer composite layer areconnected with each other to form a first connection interface betweenthe oxide layer and the polymer composite layer. The polymer compositelayer and the silver paste layer are connected with each other directlywithout the carbon paste layer to form a second connection interfacebetween the polymer composite layer and the silver paste layer.

In another aspect, the present disclosure is directed to a silver pastelayer for a stacked type capacitor without a carbon paste layer. Thesilver paste layer includes 40-90% by weight of silver powder, 0.1-5% byweight of a dispersant, 1-10% by weight of a water-soluble resin, 5-40%by weight of a solvent, and a remaining percentage by weight of water.

Therefore, through the technical features of “the polymer compositelayer is formed on the oxide layer to partially enclose the oxide layer”and “the silver paste layer is directly formed on the polymer compositelayer to directly enclose the polymer composite layer,” the stacked typecapacitor that does not require the use of a carbon paste layer, themanufacturing method thereof, and the silver paste layer allow the oxidelayer and the polymer composite layer to be connected with each other toform the first connection interface between the oxide layer and thepolymer composite layer, and allows the polymer composite layer and thesilver paste layer to be directly connected with each other to form thesecond connection interface between the polymer composite layer and thesilver paste layer.

These and other aspects of the present disclosure will become apparentfrom the following description of certain embodiments taken inconjunction with the following drawings and their captions, althoughvariations and modifications therein may be affected without departingfrom the spirit and scope of the novel concepts of the presentdisclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from thedetailed description and the accompanying drawings, in which:

FIG. 1 is a flowchart of a manufacturing method for a stacked typecapacitor according to a first embodiment of the present disclosure.

FIG. 2 is a cross-sectional view of the stacked type capacitor undergonethe steps S100 and S102 of the manufacturing method for the stacked typecapacitor according to the first embodiment of the present disclosure.

FIG. 3 is a cross-sectional view of the stacked type capacitor undergonethe step S104 of the manufacturing method for the stacked type capacitoraccording to the first embodiment of the present disclosure.

FIG. 4 is a cross-sectional view of the stacked type capacitor undergonethe step S106 of the manufacturing method for the stacked type capacitoraccording to the first embodiment of the present disclosure.

FIG. 5 is a cross-sectional view of the stacked type capacitor undergonethe step S108 of the manufacturing method for the stacked type capacitoraccording to the first embodiment of the present disclosure.

FIG. 6 is a cross-sectional view of a stacked type capacitor packagestructure according to a first embodiment of the present disclosure.

FIG. 7 is a cross-sectional view of a stacked type capacitor packagestructure according to a second embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the followingexamples that are intended as illustrative only since numerousmodifications and variations therein will be apparent to those skilledin the art. Like numbers in the drawings indicate like componentsthroughout the views. As used in the description herein and throughoutthe claims that follow, unless the context clearly dictates otherwise,the meaning of “a”, “an”, and “the” includes plural reference, and themeaning of “in” includes “in” and “on”. Titles or subtitles can be usedherein for the convenience of a reader, which shall have no influence onthe scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art.In the case of conflict, the present document, including any definitionsgiven herein, will prevail. The same thing can be expressed in more thanone way. Alternative language and synonyms can be used for any term(s)discussed herein, and no special significance is to be placed uponwhether a term is elaborated or discussed herein. A recital of one ormore synonyms does not exclude the use of other synonyms. The use ofexamples anywhere in this specification including examples of any termsis illustrative only, and in no way limits the scope and meaning of thepresent disclosure or of any exemplified term. Likewise, the presentdisclosure is not limited to various embodiments given herein. Numberingterms such as “first”, “second” or “third” can be used to describevarious components, signals or the like, which are for distinguishingone component/signal from another one only, and are not intended to, norshould be construed to impose any substantive limitations on thecomponents, signals or the like.

First Embodiment

Referring to FIGS. 1-5, a first embodiment of the present disclosureprovides a manufacturing method for a stacked type capacitor S without acarbon paste layer.

Referring to FIGS. 1 and 2, the manufacturing method for the stackedtype capacitor S according to the present disclosure includes: providinga metal foil 1 (S100), and forming an oxide layer 2 on an outer surface100 of the metal foil 1 to enclose the metal foil completely (S102). Incertain embodiments, based on different use requirements, the metal foil1 may be made of aluminum, copper or any metal material, and the surfaceof the metal foil 1 has a porous corroded layer, so the metal foil 1 maybe a corroded foil having a porous corroded layer. When the metal foil 1is oxidized, the oxide layer 2 is formed on the surface of the metalfoil 1, and the metal foil 1 on which the oxide layer 2 is formed can bereferred to as a valve metal foil. However, the present disclosure isnot limited to the examples given above.

Referring to FIGS. 1-3, the manufacturing method for the stacked typecapacitor S according to the present disclosure further includes:surroundingly forming a surrounding barrier layer R on the outer surfaceof the oxide layer 2 (S104) so as to divide the outer surface of theoxide layer 2 into a first portion 201 and a second portion 202 that areseparated from each other. In certain embodiments, based on differentuse requirements, the surrounding barrier layer R can be a conductivelayer made of any kind of conductive material, for example, aluminum orcopper, or an insulating layer made of any kind of insulation material,for example, epoxy or silicon. It is noted that based on different userequirements, the manufacturing method for the stacked type capacitor Smay skip step S104, that is, the manufacturing method for the stackedtype capacitor S does not necessarily require the use of the surroundingbarrier layer R. However, the present disclosure is not limited by theexamples given above.

Referring to FIGS. 1, 3 and 4, after step S102 or step S104, themanufacturing method for the stacked type capacitor S according to thepresent disclosure further includes: forming a polymer composite layer 3on the oxide layer 2 to partially enclose the oxide layer 2 (S106). Forexample, when the outer surface of the oxide layer 2 is divided by thesurrounding barrier layer R into the first portion 201 and the secondportion 202 that are separate from each other, the polymer compositelayer 3 is formed on the second portion 202 and encloses the secondportion 202 completely. In certain embodiments, based on different userequirements, the material used for the polymer composite layer 3 caninclude 1-5% by weight of an emulsifier, 0.1-5% by weight of a PEDOT:PSScomposite, 1-30% by weight of a conductive auxiliary (or a solventhaving a high boiling point), 0.1-15% by weight of a hydrogen bond typeadhesive, 0.01-5% by weight of a silane coupling agent, 0.5-5% by weightof a water-soluble resin, 0.001-1% by weight of a polyamine compound,and water for the remaining percentage by weight. It is noted that amongthe above-referenced materials, the emulsifier may be omitted. However,the present disclosure is not limited to the examples given above.

In certain embodiments, the conductive auxiliary may be selected fromthe group consisting of polyol, dimethyl sulfoxide (DMSO) andN-Methyl-2-Pyrrolidone (NMP). The hydrogen bond type adhesive may beselected from the group consisting of sorbitol and polyvinyl alcohol.The silane coupling agent may be selected from the group consisting of(3-Glycidyloxypropyl)triethoxysilane, (3-Aminopropyl)triethoxy silane,(3-Mercaptopropyl)trimethoxysilane,3-Methacryloxypropyltrimethoxysilane, Vinyltrimethoxysilane, andTriethoxyoctylsilane. Water-soluble resin may be selected from the groupconsisting of water-based polyurethane, water-based polyethylene,polyester, and water-based polymethylmethacrylate. Polyol may beselected from the group consisting of ethylene glycol, glycerol,polyethylene glycol and polyglycefine. Polyamine may be selected fromthe group consisting of aliphatic amines, amides, aromatic amines, aminoacids, polymeric amines, and polyether amines. Aliphatic amines mayinclude α,ω-diamines, for example, 1,4-diaminocyclohexane, or1,4-bisaminomethyl(cyclohexane). Linear aliphatic α,ω-diamines or thederivatives thereof may exemplarily be ethylenediamine,1,6-hexanediamine, 1,7-heptanediamine, 1,8-octanediamine,1,9-nonanediamine, 1,10-decanediamine, 1,12-dodecanediamine,N,N-dimethylethylenediamine, N,N,N′N′tetramethyl-1,4,butanediamine,N,N,N,N′N′N′-hexamethylhexane methylene-diammonium dibromide,piperazine, 1-(3-aminopropyl)piperazine, 1-(2-aminoethyl)piperazine,1,4-diazabicyclo[2.2.2]octane,N,N,N′N-tetrakis(2-hydroxypropyl)ethylenediamine,N-[3-(trimethoxysilyl)propyl]ethylenediannine or1,4-bis(3-amino-propyl)piperazine. Amides may exemplarily beN,N′-diacetyl-1,6-hexanediamine, N,N,N′N′-tetraacetylethylene-diamine,1,4-diformylpiperazines, or N,N′-ethylenebis(stearamide). Aliphaticamines may include linear aliphatic amines having at least three amines,for example, 1,4-Bis(3-aminopropyl)piperazine,N-(6-aminohexyl)-1,6-diaminohexane, N-(3-aminopropyl)-1,4-diaminobutane,and 3-[2-(2-aminoethylamino)ethyleneamino]propyltrimethoxysilane.Aromatic amines having at least two amines may exemplarily be brilliantgreen, 4,4′-methylenebis(N,N-diglycidylaniline), o-phenylene-di-amine,m-phenylenediamine, p-phenylenediamine, 1,5-diaminonaphthalene,1,8-diaminonaphthalene, 2,3-diaminonaphthalene, 3-aminophenyl sulfone,4-aminophenyl sulfone, 4-aminophenyl ether, 3-3′-diaminobenzidine,2-(4-aminophenyl)ethylamine, 4,4′-methylenendianiline,2,6-diaminotoluene, N,N,N′N′-tetramethyl-p-phenylenediamine,4,4′-bis(diethylamino)benzophenone, 4,4′-bis(dimethyl-amino)benzhydrol,3,3′,5,5′-tetramethylbenzidine, Auramine O, Rubine S, m-xylenediamine,phthalein, complexone, Brilliant Blue G or folic acid. Aromatictriamines may exemplarily be 4,4′,4″-methyliditetris(N,N-dimethylaniline). Polyamines may exemplarily be poly(propyleneglycol)bis(2-aminopropyl) ether, poly ethyleneimine, poly (ally lamine),and ethoxylated poly ethyl enimine. Polyethers may exemplarily beselected from the group consisting of NH2-(CH2)x(CH2CH2O)y(CH2)z-NH2,wherein each of x and z is an integer from 0 to 3, and y is an integerfrom 2 to 8, and imidazole derivatives, for example,1-(3-aminopropyl)imidazole. However, the present disclosure is notlimited thereto.

Further, as shown in FIG. 1, FIG. 4 and FIG. 5, the manufacturing methodfor the stacked type capacitor S further includes: directly forming asilver paste layer 4 on the polymer composite layer 3 to directlyenclose the polymer composite layer 3 (S108). For example, the silverpaste layer 4 is formed on an outer surface 300 of the polymer compositelayer 3 and completely encloses the outer surface 300 of the polymercomposite layer 3. For example, according to different use requirements,the material used for the silver paste layer 4 may include 40-90% byweight of silver powder, 0.1-5% by weight of a dispersant, 1-10% byweight of a water-soluble resin, 5-40% by weight of a solvent, and waterfor the remaining percentage by weight. However, the present disclosureis not limited thereto.

Further, for example, the silver powder has a particle size between 1and 50 μm, and the silver powder can be of various shapes such as silverballs, silver sheets and the like. The dispersant may be ahyperdispersant with an acid group or an amino group. Water-solubleresin may be selected from the group consisting of water-basedpolyurethane, water-based polyethylene, polyester, and water-basedpolymethylmethacrylate. The solvent is selected from the groupconsisting of polyol, methyl ethyl ketone, methyl isobutyl ketone, andbutyl acetate. Polyol is selected from the group consisting of ethyleneglycol, glycerol, polyethylene glycol, polyglycefine, ethylene glycolmonobutylether, and ethylene glycol butyl ether. However, the presentdisclosure is not limited thereto.

For example, as shown in FIG. 5, a distance D1 from an outer peripheralsurface R100 of the surrounding barrier layer R relative to the oxidelayer 2 may be greater than, less than or equal to a distance D2 from anouter surface 400 of the silver paste layer 4 to the oxide layer 2. Thatis, when the distance D1 from the outer peripheral surface R100 of thesurrounding barrier layer R to the oxide layer 2 is greater than, lessthan or equal to the distance D2 from the outer surface 400 of thesilver paste layer 4 to the oxide layer 2, both the polymer compositelayer 3 and the silver paste layer 4 are restricted by the surroundingbarrier layer R and do not cross the surrounding barrier layer R. Inaddition, one end of the polymer composite layer 3 and one end of thesilver rubber layer 4 are in contact with or separated from thesurrounding barrier layer R, so that the length of the polymer compositelayer 3 and the length of the silver paste layer 4 are both restrictedby the surrounding barrier layer R. However, the present disclosure isnot limited thereto.

It should be noted that, as shown in FIG. 5, the oxide layer 2 and thepolymer composite layer 3 are connected with each other to form a firstconnection interface C1 between the oxide layer 2 and the polymercomposite layer 3, and the polymer composite layer 3 and the silverpaste layer 4 are directly connected with each other without a carbonpaste layer, so as to form a second connection interface C2 between thepolymer composite layer 3 and the silver paste layer 4. That is to say,the polymer composite layer 3 and the silver paste layer 4 are directlyconnected with each other to form a two-layer structure, so that nocarbon paste layer exists between the polymer composite layer 3 and thesilver paste layer 4.

Furthermore, as shown in FIG. 5, the first embodiment of the presentdisclosure further provides the stacked type capacitor S that does notrequire the use of a carbon paste layer, which includes the metal foil1, the oxide layer 2, the polymer composite layer 3 and the silver pastelayer 4. The oxide layer 2 is formed on the outer surface 100 of themetal foil 1 to completely enclose the metal foil 1. The polymercomposite layer 3 is formed on the oxide layer 2 to partially enclosethe oxide layer 2. The silver paste layer 4 is directly formed on thepolymer composite layer 3 to directly enclose the polymer compositelayer 3. Further, the oxide layer 2 and the polymer composite layer 3are connected with each other to form the first connection interface C1between the oxide layer 2 and the polymer composite layer 3, and thepolymer composite layer 3 and the silver paste layer 4 are directlyconnected with each other without a carbon paste layer to form thesecond connection interface C2 between the polymer composite layer 3 andthe silver paste layer 4.

For example, as shown in FIG. 5, the stacked type capacitor S that doesnot require the use of a carbon paste layer further includes thesurrounding barrier layer R, and the surrounding barrier layer R iscircumferentially formed on an outer surface of the oxide layer 2 todivide the outer surface of the oxide layer 2 into the first portion 201and the second portion 202 which are separated from each other. Inaddition, the polymer composite layer 3 is formed on and completelyencloses the second portion 202 of the oxide layer 2, and the silverpaste layer 4 is formed on and completely encloses the polymer compositelayer 3. However, the present disclosure is not limited thereto.

For example, as shown in FIG. 5, the distance D1 from the outerperipheral surface R100 of the surrounding barrier layer R to the oxidelayer 2 may be greater than, less than or equal to the distance D2 fromthe outer surface 400 of the silver paste layer 4 to the oxide layer 2.That is, when the distance D1 from the outer peripheral surface R100 ofthe surrounding barrier layer R to the oxide layer 2 is greater than,less than or equal to the distance D2 from the outer surface 400 of thesilver paste layer 4 to the oxide layer 2, the polymer composite layer 3and the silver paste layer 4 are restricted by the surrounding barrierlayer R and do not cross the surrounding barrier layer R. In addition,one end of the polymer composite layer 3 and one end of the silverrubber layer 4 are in contact with or separated from the surroundingbarrier layer R, so that the length of the polymer composite layer 3 andthe length of the silver paste layer 4 are both restricted by thesurrounding barrier layer R. However, the present disclosure is notlimited thereto.

It is to be noted that, as shown in FIG. 5, the first embodiment of thepresent disclosure provides the polymer composite layer 3 applicable tothe stacked type capacitor S which requires no carbon paste layer. Thestacked type capacitor S includes the metal foil 1, the oxide layer 2,the polymer composite layer 3 and the silver paste layer 4. Further, theoxide layer 2 is formed on the outer surface of the metal foil 1 tocompletely enclose the metal foil 1, and the polymer composite layer 3is formed on the oxide layer 2 to partially enclose the oxide layer 2.Silver paste layer 4 is directly formed on the polymer composite layer 3to directly enclose the polymer composite layer 3. The polymer compositelayer 3 may further include a bottom layer and a soluble nanoparticlepolymer enclosing layer. The polymer composite layer 3 is formed byfirst forming the bottom layer on the oxide layer 2, and then formingthe soluble nanoparticle polymer enclosing layer. The bottom layerformed on the oxide layer 2 may have a thickness of less than 1 μm. Forexample, the bottom layer may include a plurality of solublenanoparticles, and the soluble nanoparticles are made of nano-scaleconductive polymer materials, and may be made of aniline, polypyrrole,polythiophene, PEDOT:PSS composite or any combination thereof. It isworth mentioning that the bottom layer can be formed by multiple coatingand drying steps. For example, the coating-drying step can be repeated 3to 15 times to ensure the effectiveness of the bottom layer.Furthermore, the bottom layer may be a chemically polymerized polymerbottom layer, a soluble nanoparticle polymer bottom layer, or the twobeing formed sequentially on the oxide layer 2. For example, accordingto different use requirements, the material used for the polymercomposite layer 3 includes 1-5% by weight of an emulsifier, 0.1-5% byweight of a PEDOT:PSS composite, 1-30% by weight of a conductiveauxiliary (or a solvent having a high boiling point), 0.1-15% by weightof hydrogen bond type adhesive, 0.01-5% by weight of silane couplingagent, 0.5-5% by weight of a water-soluble resin, 0.001-1% by weight ofpolyamine compound, and water for the remaining percentage by weight. Inparticular, among the materials used for the polymer composite layer 3,the emulsifier can be omitted. However, the present disclosure is notlimited thereto.

Solid electrolytic capacitors use solid electrolytes instead of liquidelectrolytes as cathodes, and conductive polymers have been widely usedas cathode materials for solid electrolytic capacitors because of theirhigh electrical conductivity and easy manufacturing processes. Theconductive polymer materials include polyaniline (PAni), polypyrrole(PPy), polythiophene (PTh) and derivatives thereof. PEDOT:PSS hasexcellent electrical conductivity. A PEDOT:PSS composite has a lowerpolymerization rate than other polymers such as PAni and PPy, andtherefore can undergo polymerization reactions at normal temperature toreduce the difficulty of its preparation. In addition, the PEDOT:PSScomposite has better weather resistance and heat resistance than otherpolymers. Further, the PEDOT:PSS composite also has good dispersibility,low production cost, high transparency, and excellent processability.Therefore, Using a PEDOT:PSS composite as a raw material for forming thepolymer composite layer 3 on a cathode portion of a capacitorcontributes greatly to the improvement of the electrical effects of thecapacitor.

It should be noted that, as shown in FIG. 5, the first embodiment of thepresent disclosure provides the silver paste layer 4 applicable to thestacked type capacitor S that does not require the use of a carbon pastelayer, and the stacked type capacitor S includes the metal foil 1, theoxide layer 2, the polymer composite layer 3, and the silver paste layer4. Further, the oxide layer 2 is formed on the outer surface of themetal foil 1 to completely enclose the metal foil 1, and the polymercomposite layer 3 is formed on the oxide layer 2 to partially enclosethe oxide layer 2. The silver paste layer 4 is directly formed on thepolymer composite layer 3 to directly enclose the polymer compositelayer 3. For example, according to different use requirements, thematerial used for the silver paste layer 4 includes 40-90% by weight ofsilver powder, 0.1-5% by weight of a dispersant, 1-10% by weight of awater-soluble resin, and 5-40% by weight of a solvent, and water for theremaining percentage by weight. However, the present disclosure is notlimited thereto.

It is noted that, as shown in FIG. 6, the first embodiment of thepresent disclosure further provides a stacked type capacitor packagestructure Z that does not require the use of a carbon paste layer, andincludes a conductive bracket F, a plurality of stacked type capacitorsS and a package encapsulant M.

First, as shown in FIG. 6, the conductive support F includes at leastone positive electrode conductive terminal F1 and at least one negativeelectrode conductive terminal F2 separated from the at least onepositive conductive terminal F1. Further, the at least one positiveelectrode conductive terminal F1 has a first embedded portion F11, afirst exposed portion F12, and at least one first through hole F100penetrating through the first embedded portion F11. In addition, the atleast one negative electrode conductive terminal F2 has a secondembedded portion F21, a second exposed portion F22, and at least onesecond through hole F200 penetrating through the second embedded portionF21.

Furthermore, as shown in FIG. 5 and FIG. 6, a plurality of stacked typecapacitors S are stacked in sequence and disposed between the at leastone positive electrode conductive terminal F1 and the at least onenegative electrode conductive terminal F2, and each stacked typecapacitor S has a positive electrode terminal P and a negative electrodeterminal N. For example, as shown in FIG. 5, each stacked type capacitorS includes the metal foil 1, the oxide layer 2, the polymer compositelayer 3, and the silver paste layer 4. The oxide layer 2 is formed onthe outer surface of the metal foil 1 to completely enclose the metalfoil 1. The polymer composite layer 3 is formed on the oxide layer 2 topartially enclose the oxide layer 2. The silver paste layer 4 isdirectly formed on the polymer composite layer 3 to directly enclose thepolymer composite layer 3.

Further, as shown in FIG. 6, all of the plurality of stacked typecapacitors S and a portion of the conductive bracket F are covered byand embedded in the package encapsulant M. Further, the plurality ofstacked type capacitors S, the first embedded portion F11 of thepositive electrode conductive terminal F1, and the second embeddedportion F21 of the negative electrode conductive terminal F2 arecompletely covered by and embedded in the package encapsulant M, and thefirst exposed portion F12 of the positive electrode conductive terminalF1 and the second exposed portion F22 of the negative electrodeconductive terminal F2 are exposed outside the package encapsulant M. Itshould be noted that the at least one first through hole F100 of thepositive electrode conductive terminal F1 and the at least one secondthrough hole F200 of the negative electrode conductive terminal F2 arefilled by the package encapsulant M, so the bonding strength between theconductive bracket F and the package encapsulant M can be effectivelyincreased, so as to increase the structural strength of the stacked typecapacitor package structure Z itself and the electrical characteristicsit provides.

It is noted that since the material used in the polymer composite layer3 and the material used in the silver paste layer 4 have water-solubleresins, the compatibility between the polymer composite layer 3 and thesilver paste layer 4 is good. The interface resistance between thepolymer composite layer 3 and the silver paste layer 4 is low, and thetwo has a lower equivalent series resistance (ESR). For example, aconventional phenolic resin type silver paste has an ESR of about 100 to500 milliohms, and a conventional epoxy type silver paste has an ESR ofabout 500 to 1000 milliohms, while the aqueous resin type silver pasteof the present disclosure has an ESR about 3 to 80 milliohms. Inaddition to a reduced ESR, while dispensing the use of a carbon pastelayer, the capacitance (Cap), dissipation factor (DF) and leakagecurrent (LC) of the stacked type capacitor package structure Z of thepresent disclosure still meet requirements.

Second Embodiment

Referring to FIG. 7, a second embodiment of the present disclosureprovides a stacked type capacitor package structure Z that does notrequire the use of a carbon paste layer, and includes a conductivebracket F, the plurality of stacked type capacitors S, and the packageencapsulant M. It can be seen from the comparison between FIG. 7 andFIG. 6 that one of the differences between the second embodiment and thefirst embodiment is that the stacked type capacitor package structure Zof the second embodiment further includes a plurality of additionalstacked type capacitors S2.

Further, the plurality of additional stacked type capacitors S2 arestacked in sequence and disposed between the at least one positiveelectrode conductive terminal F1 and the at least one negative electrodeconductive terminal F2, and each additional stacked type capacitor S2has a positive electrode terminal P2 and a negative electrode terminalN2. In addition, all of the plurality of additional stacked typecapacitors S2 are covered by and embedded in the package encapsulant M,and the stacked type capacitors S and the stacked type capacitors S2 arerespectively located on opposite lateral sides of the conductive bracketF.

Therefore, through the technical features of “the polymer compositelayer 3 is formed on the oxide layer 2 to partially enclose the oxidelayer 2” and “the silver paste layer 4 is directly formed on the polymercomposite layer 3 to directly enclose the polymer composite layer 3,”the stacked type capacitor S and the manufacturing method thereof, andthe silver paste layer 4 allow the oxide layer 2 and the polymercomposite layer 3 to be connected with each other to form the firstconnection interface C1 between the oxide layer 2 and the polymercomposite layer 3, and allows the polymer composite layer 3 and thesilver paste layer 4 to be directly connected with each other to formthe second connection interface C2 between the polymer composite layer 3and the silver paste layer 4.

It should be noted that the at least one first through hole F100 of thepositive electrode conductive terminal F1 and the at least one secondthrough hole F200 of the negative electrode conductive terminal F2 arefilled by the package encapsulant M, so the bonding strength between theconductive support F and the package encapsulant M can be effectivelyincreased, which further increases the structural strength of thestacked type capacitor package structure Z itself and the electricalcharacteristics that it provides.

The foregoing description of the exemplary embodiments of the presentdisclosure has been presented only for the purposes of illustration anddescription and is not intended to be exhaustive or to limit the presentdisclosure to the precise forms disclosed. Many modifications andvariations are possible in light of the above teaching.

Certain embodiments were chosen and described in order to explain theprinciples of the present disclosure and their practical application soas to enable others skilled in the art to utilize the present disclosureand various embodiments and with various modifications as are suited tothe particular use contemplated. Alternative embodiments will becomeapparent to those skilled in the art to which the present disclosurepertains without departing from its spirit and scope.

What is claimed is:
 1. A manufacturing method for a stacked typecapacitor without a carbon paste layer, comprising: providing a metalfoil; forming an oxide layer on an outer surface of the metal foil toentirely enclose the metal foil; forming a polymer composite layer onthe oxide layer to partially enclose the oxide layer; wherein thepolymer composite layer includes 0.1-5% by weight of apoly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS)composite, 1-30% by weight of a conductive auxiliary, 0.1-15% by weightof a hydrogen bond type adhesive, 0.01-5% by weight of a silane couplingagent, 0.5-5% by weight of a water-soluble resin, and 0.001-1% by weightof a polyamine compound; wherein the conductive auxiliary is selectedfrom the group consisting of polyol, dimethyl sulfoxide (DMSO), andN-methyl-2-pyrrolidone (NMP); the hydrogen bond type adhesive isselected from the group consisting of sorbitol and polyvinyl alcohol;the water-soluble resin is selected from the group consisting ofwater-based polyurethane, water-based polyethylene, polyester, andwater-based polymethylmethacrylate; and the polyol is selected from thegroup consisting of ethylene glycol, glycerol, polyethylene glycol, andpolyglycefine; and forming a silver paste layer directly on the polymercomposite layer to directly enclose the polymer composite layer; whereinthe oxide layer and the polymer composite layer are connected with eachother to form a first connection interface between the oxide layer andthe polymer composite layer, and the polymer composite layer and thesilver paste layer are connected with each other directly without thecarbon paste layer to form a second connection interface between thepolymer composite layer and the silver paste layer.
 2. The manufacturingmethod for the stacked type capacitor without the carbon paste layeraccording to claim 1, further including: surroundingly forming asurrounding barrier layer on an outer surface of the oxide layer todivide the outer surface of the oxide layer into a first portion and asecond portion separate from the first portion, wherein the polymercomposite layer is formed on and completely encloses the second portion,the silver paste layer is formed on and completely encloses an outersurface of the polymer composite layer, and a first distance from anouter peripheral surface of the surrounding barrier layer to the oxidelayer is greater than, smaller than, or equal to a second distance froman outer peripheral surface of the silver paste layer to the oxidelayer.
 3. The manufacturing method for the stacked type capacitorwithout the carbon paste layer according to claim 2, wherein an end ofthe polymer composite layer and an end of the silver paste layer are incontact with or separate from the surrounding barrier layer, and alength of the polymer composite layer and a length of the silver pastelayer are restricted by the surrounding barrier layer.
 4. Themanufacturing method for the stacked type capacitor without the carbonpaste layer according to claim 1, wherein the silver paste layerincludes 40-90% by weight of silver powder, 0.1-5% by weight of adispersant, 1-10% by weight of a water-soluble resin, and 5-40% byweight of a solvent; and wherein the silver powder has a particle sizebetween 1 and 50 μm; the dispersant is a hyperdispersant with an acidgroup or an amino group; the water-soluble resin is selected from thegroup consisting of water-based polyurethane, water-based polyethylene,polyester, and water-based polymethylmethacrylate; the solvent isselected from the group consisting of polyol, methyl ethyl ketone,methyl isobutyl ketone, and butyl acetate; and the polyol is selectedfrom the group consisting of ethylene glycol, glycerol, polyethyleneglycol, polyglycefine, ethylene glycol monobutylether, and ethyleneglycol butyl ether.
 5. A silver paste layer for a stacked type capacitorwithout a carbon paste layer, comprising 40-90% by weight of silverpowder, 0.1-5% by weight of a dispersant, 1-10% by weight of awater-soluble resin, 5-40% by weight of a solvent; wherein the silverpaste layer is disposed on a polymer composite layer; wherein thepolymer composite layer includes 0.1-5% by weight of apoly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS)composite, 1-30% by weight of a conductive auxiliary, 0.1-15% by weightof a hydrogen bond type adhesive, 0.01-5% by weight of a silane couplingagent, 0.5-5% by weight of a water-soluble resin, and 0.001-1% by weightof a polyamine compound; wherein the conductive auxiliary is selectedfrom the group consisting of polyol, dimethyl sulfoxide (DMSO), andN-Methyl-2-Pyrrolidone (NMP); the hydrogen bond type adhesive isselected from the group consisting of sorbitol and polyvinyl alcohol;the water-soluble resin is selected from the group consisting ofwater-based polyurethane, water-based polyethylene, polyester, andwater-based polymethylmethacrylate; and the polyol is selected from thegroup consisting of ethylene glycol, glycerol, polyethylene glycol, andpolyglycefine.
 6. The silver paste layer for the stacked type capacitorwithout the carbon paste layer according to claim 5, wherein the polymercomposite layer further including a chemically polymerized polymerbottom layer and a soluble nanoparticle polymer enclosing layer formedon the soluble nanoparticle polymer enclosing layer.
 7. The silver pastelayer for the stacked type capacitor without the carbon paste layeraccording to claim 5, wherein the polymer composite layer furtherincluding a soluble nanoparticle polymer bottom layer and a solublenanoparticle polymer enclosing layer formed on the soluble nanoparticlepolymer bottom layer.
 8. The silver paste layer for the stacked typecapacitor without the carbon paste layer according to claim 5, whereinthe polymer composite layer further including a chemically polymerizedpolymer bottom layer, a soluble nanoparticle polymer bottom layer formedon the chemically polymerized polymer bottom layer, and a solublenanoparticle polymer enclosing layer formed on the soluble nanoparticlepolymer bottom layer.
 9. The silver paste layer for the stacked typecapacitor without the carbon paste layer according to claim 5, furtherincludes 1-5% by weight of an emulsifier.